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sf6 o2 vacuum

Aug 23, 2009Comparison of the SF6 And Vacuum Technologies. The most important characteristics of the SF6 gas and vacuum-circuit breakers, i.e., of SF6 gas and vacuum as arc-extinguishing media are summarized in Table-1.. In the case of the SF6 circuit-breaker, interrupters which have reached the limiting number of operations can be overhauled and restored to 'as new' condition.

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  • Chemistry studies of SF6/CF4, SF6/O2 and CF4/O2 gas phase

    Vacuum. Volume 106, August 2014, Pages 64-68. Chemistry studies of SF 6 /CF 4, SF 6 /O 2 and CF 4 /O 2 gas phase during hollow cathode reactive ion etching plasma. Author links open overlay panel L.L. Tezani a R.S. Pessoa a b H.S. Maciel a b G. Petraconi a. Show more. Share. Cite.Cited by: 11

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  • Comparison Between Vacuum and SF6 Circuit Breaker

    Aug 29, 2018The most important characteristics of the SF6 gas and vacuum-circuit breakers, i.e., of SF6 gas and vacuum as arc-extinguishing media are summarized in Table-1. In the case of the SF6 circuit-breaker, interrupters which have reached the limiting number of operations can be overhauled and restored to ‘as new’ condition.

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  • Experimental investigation of SF6–O2 plasma for

    Apr 21, 2017This study examines the impact of varying the internal process parameters, such as the concentrations of oxygen and fluorine in a SF 6 –O 2 plasma, in two capacitively coupled plasma etch chambers with different geometries. Silicon wafers were used to investigate the anisotropic nature ofCited by: 1

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  • High-aspect-ratio deep Si etching in SF6/O2 plasma. II

    Jul 28, 2010In this article, the authors focus on the profiles formed by high-aspect-ratio deep Si etching with SF 6 / O 2 plasma mixtures. One of the most serious problems for deep Si etching processes is lateral etching in the upper regions of sidewalls. This lateral etching seems to depend on time (or etched depth) rather than aspect ratio (depth/width). Reducing the SF 6: O 2 ratio and lowering theCited by: 10

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  • High-aspect-ratio deep Si etching in SF6/O2 plasma. I

    Jul 28, 2010Abstract This article presents a study of the characteristics of radicals in high-aspect-ratio deep Si etching by continuous-type SF 6 / O 2 plasmas. A parametric study of etched depths clearly shows that the Si etch rates are dependent on concentrations of F atoms but independent of ion energy and substrate temperature.Cited by: 16

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  • SF6 gas in medium-voltage switchgear | TD Guardian

    SF6 has been used extensively in non-electrical applications. Since SF6 is inert, it is very attractive to the magnesium industry. Magnesium reacts spontaneously in the presence of oxygen, so a heavier-than-air cover gas is used to isolate the molten magnesium from oxygen as the magnesium cools.

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  • SF6 Gas Detection For HV GIS Switchgear - Crowcon F-Gas

    Sep 30, 2020Sulphur Hexaflouride (commonly referred to as “SF6”) is an inorganic, colourless, odourless, non-flammable, heavy gas that has exceptional electrical insulation performance. Gas detection is specifed for safe monitoring and measurement of SF6 levels on HV EHV Gas Insulated Switchgear (GIS) and Transformer rooms, 66kV-220kV.

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  • Oxidation of sulfur hexafluoride - ScienceDirect

    Because exploding metals react chemically with both SF6 and Oz, it becomes necessary to explode extremely small metal masses, if one wishes to study only SF6-O2 reactions. Ideally, if the metal/SF6 ratio is _sufficiently low, the explosion of the metal serves only to transfer energy from the storage capacitors to the 1. H. L.

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  • Switchgear SF orvacuum?

    6 and vacuum switchgear enjoy varying market success in the different parts of the world ; whereas Europe and most of the Middle East countries tend to favor SF 6, China, Japan and the USA definitely prefer vacuum. In other regions, the two technologies are equally popular. Bulk-oil and minimum-oil technologies are still used in China,

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  • EU Report Highlights Sulphur Hexafluoride Countdown

    In HV, a 170kV gas insulated switchgear (GIS) based Novec 5110 mixture with CO2 and O2 was the first SF6 alternative installed in a HV GIS, located in Zurich in 2015.

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  • Precision plasma etching of Si, Ge, and Ge:P by SF6 with

    Mar 31, 2014The impact of the O2content in SF6-O2gas mixtures on the etch rate and sidewall profile of silicon (Si), germanium (Ge), and phosphorous doped germanium (Ge:P) in reactive ion etching has been studied. The characteristics of etch rate and sidewall profile are greatly affected by the O2content.

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  • SF6 Gas Detection For HV GIS Switchgear - Crowcon F-Gas

    "In addition to using an F-Gas Detector, confined spaces with a potential exposure to SF6 should be monitored for their O2 content (remember that if there is less than 20.9% O2, something is displacing the oxygen). Also, the presence of combustible gases should be monitored.

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  • Surface interactions of SO2 and passivation chemistry

    A variety of materials can be etched in SF6/O2 plasmas. Here, the fate of SO2 at Si and SiO2 surfaces during etching in SF6/O2 plasmas has been explored using the imaging of radicals interacting wi...

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  • SF6 or Vacuum MV Circuit Breaker?

    Jun 22, 2014SF6 or vacuum? Approximately 35 years ago, in the mid 1960s, two new breaker technologies, one using SF6 gas and the other vacuum as its arc quenching medium, were introduced to the market. SF6 or Vacuum?

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  • Fundamental insulation characteristics of air; N2, CO2, N2

    SF 6 gas has excellent dielectric strength and interruption performance. For these reasons, it has been widely used for gas‐insulated switchgear (GIS). However, use of SF 6 gas has become regulated under agreements set at the 1997 COP3. Presently, development of a gas circuit breaker (GCB) using CO 2 gas and development of a high‐voltage vacuum circuit breaker (VCB) are being pursued.

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  • Comparison Between Vacuum and SF6 Circuit Breaker

    Aug 23, 2009Comparison of the SF6 And Vacuum Technologies. The most important characteristics of the SF6 gas and vacuum-circuit breakers, i.e., of SF6 gas and vacuum as arc-extinguishing media are summarized in Table-1.. In the case of the SF6 circuit-breaker, interrupters which have reached the limiting number of operations can be overhauled and restored to ‘as new’ condition.

    Get Price
  • Myth About SF6 Gas In Electrical Equipment

    May 25, 2020Pure SF6 is physiologically completely harmless for humans and animals. It’s even used in medical diagnostic. Due to its weight it might displace the oxygen in the air, if large quantities are concentrating in deeper and non ventilated places. Legislation for chemicals does not categorise SF6 as a hazardous material.

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  • Temperature influence on etching deep holes with SF6/O2

    A cryogenic SF6/O2 plasma process has been used to investigate the etching of deep holes in silicon wafers. The influence of crystallographic and aspect ratio dependence of the etch rate on the...

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  • Electron Density and Optical Emission Measurements of SF6

    Plasma Science and Technology, Vol.14, No.4, Apr. 2012 Fig.2 (a) A typical optical emission spectra of SF6/Ar plasma at 300 W power and 100 mT pressure, and (b) of SF6/O2 (60%)/Ar plasma at 300 W power and 100 mT pressure

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  • Capacitively coupled SF6, SF6/O2, SF6/CH4 plasma etching

    This study investigated dry etching of acrylic in capacitively coupled SF6, SF6/O2 and SF6/CH4 plasma under a low vacuum pressure. The process pressure was 100 mTorr and the total gas flow rate

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  • Etching mechanism of the single-step through-silicon-via

    Low-pressure inductively coupled plasma etching of benzocyclobutene with SF6/O2 plasma chemistry J. Vac. Sci. Technol. B 30, 06FF06 (2012); 10.1116/1.4758765 Kinetics of electron attachment to SF3CN, SF3C6F5, and SF3 and mutual neutralization of Ar+ with CN and C6F5 J. Chem. Phys. 134, 044323 (2011); 10.1063/1.3529423

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  • Fundamental insulation characteristics of air; N2, CO2, N2

    SF6 gas has excellent dielectric strength and interruption performance. For these reasons, it has been widely used for gas-insulated switchgear (GIS). However, use of SF6 gas has become regulated under agreements set at the 1997 COP3. Presently, development of a gas circuit breaker (GCB) using CO2 gas and development of a high-voltage vacuum circuit breaker (VCB) are being pursued.

    Get Price
  • Chemistry studies of SF6/CF4, SF6/O2 and CF4/O2 gas phase

    Aug 01, 2014The vacuum system consists of two pumps that are combined to achieve a background pressure of about 10 −4 Torr. The first is a mechanical pump (E2M-80 – Edwards) and the second a roots-type pump (EH500 – Edwards), thus providing an effective pumping speed of 110 L/s. The working gases were inserted through a shower distributor located at

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  • Sulfur dioxide analyzer - Rapidox SF6 6100 Pump Back

    Other measureable gases include H2O, SO2, HF, O2 CF4. A number of configurations are available to suit application requirements. Once connected the analyser samples gas automatically, allowing safe operation. A vacuum purge cycle gas storage system ensures that no air can contaminate the sample no gas is able to escape during the test.

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  • SF6 Gas Decomposed! Best handling practices APC

    • SF6 Cylinder(s) empty (Under Vacuum) • SF6 Recovery and Testing Equipment • Denatured alcohol • Atmosphere/air monitor . 5 . Alabama Power Company / Southern Company SF6 Best Practices • Clean-up Supplies • Distilled Water • Baking Soda • Pump up

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  • NNCI Site Tool Type Gases Application Wafer size SF6, C4F8

    SF6, C4F8, O2, Ar Deep silicon etch; 100mm Mixed silicon etch 150mm; Release Cornell Ptherm 770 left chamber ICP; Cl2, BCl3, SF6, O2, N2, metal etch 100mm Vacuum silicon based Vision 300MK2 dielectrics. Washington Advanced RIE. CF4, CHF3, SF6, O2,Ar silicon. up to 300mm Vacuum

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  • Maintaining reproducible plasma reactor wall conditions

    Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, 20(4), AB - The removal of silicon oxychloride films deposited on the chamber walls during Cl2/O2 plasma etching of Si using an SF6 plasma was studied using multiple surface and plasma diagnostic techniques. Focus was on the changes in the gas phase and in the chemical

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  • C4F8/Ar/O2およびC4F8/SF6/O2混合ガスにおけ

    Translate this pageC4F8/Ar/O2およびC4F8/SF6/O2混合ガスにおける13.56MHz放電中のイオン種; C4F8/Ar/O2およびC4F8/SF6/O2混合ガスにおける13.56MHz放電中のイオン種; Ionic Species in 13.56MHz Discharges in C4F8/Ar/O2 and C4F8/SF6/O2 Mixtures.

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  • MENU - Massachusetts Institute of Technology

    The type of etch gas (e.g. Cl2 vs BCl3, or SF6 vs CF4) and additional gases (e.g. Ar, O2, N2) can be critical for enabling certain types of etches over others. The mixing of fluorine and chlorine chemistries is strongly discouraged, as it can result in chamber hysteresis and irreproducible results.

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